每日英語跟讀 Ep.K589: Japanese Prime Minister Invites TSMC Chairman for a Rare Meeting
Taiwanese Semiconductor Manufacturing Co (TSMC) Chairman, Mark Liu, has received an invitation to meet with Japanese Prime Minister Fumio Kishida in Japan. This meeting is particularly noteworthy as it is uncommon for top executives from major semiconductor companies worldwide to convene in a single location. TSMC confirmed Liu's attendance at the meeting but provided no further details.
According to reports, executives from several prominent global semiconductor firms, including TSMC, Micron Technology Inc, Applied Materials Inc, International Business Machines Corp, Intel Corp, Samsung Electronics Co, and Belgium's semiconductor research group Interuniversity Microelectronics Centre, have been invited to the discussions at the prime minister's office. The gathering of top executives from these industry leaders is an exceptional occurrence.
Japanese Prime Minister Fumio Kishida, along with Japanese Minister of Economy, Trade and Industry Yasutoshi Nishimura and other senior officials, will attend the meeting. The focus of the discussions will be to strengthen Japan's economic security and enhance the country's semiconductor supply chain. During the meeting, the executives are expected to outline their investment and business development plans in Japan.
Recognizing the importance of collaboration, Japanese Chief Cabinet Secretary Hirokazu Matsuno emphasized that achieving semiconductor supply chain resilience requires the concerted efforts of like-minded nations and regions, rather than relying on individual countries alone. The meeting aligns with the growing calls from the United States for its allies to work together in addressing challenges posed by China in the semiconductor industry and other technological domains.
TSMC's commitment to Japan is evident through its ongoing endeavors in the country. The company is constructing a wafer fab in Kumamoto, Japan, with plans for commercial production next year. Additionally, TSMC established the TSMC Japan 3DIC R&D Center, a subsidiary aimed at developing advanced integrated circuit packaging and testing services, to provide comprehensive solutions to customers utilizing the chipmaker's cutting-edge chips. The subsidiary's clean room facility was inaugurated in June of last year. TSMC's dedication to innovation extends beyond the conventional path of shrinking transistor sizes, as it aims to drive semiconductor technology forward through system-level advancements that enhance computing performance and enable increased functionality.
Reference article: https://www.taipeitimes.com/News/biz/archives/2023/05/18/2003799976